This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignees: Bead Origin Inc., Sungkyunkwan University. Active years: 2025.
Company Filing History:
1 out of 2 
1 out of 1,349 
Years Active: 2025
Title: The Innovations of Donghak Kim
Introduction
Donghak Kim is a notable inventor based in Busan, South Korea. He has made significant contributions to the field of materials science, particularly in the development of advanced inorganic particles. His work focuses on enhancing the performance of chemical mechanical polishing (CMP) processes, which are crucial in semiconductor manufacturing.
Latest Patents
Donghak Kim holds a patent for "Spherical inorganic particles having surface bumps formed thereon, and method of manufacturing same." This innovative inorganic particle is composed of an aggregation of crystalline and amorphous small particles, featuring a spherical and smooth surface. The unique characteristics of these particles, including their low crystallinity and narrow particle size distribution, are advantageous in reducing scratch defects during the CMP process. Furthermore, the small particles on the surface provide more active sites, resulting in an excellent removal rate, making them ideal as next-generation CMP abrasives.
Career Highlights
Throughout his career, Donghak Kim has worked with various organizations, including Bead Origin Inc. and Sungkyunkwan University. His experience in these institutions has allowed him to refine his expertise in materials science and contribute to innovative solutions in the industry.
Collaborations
Some of his notable coworkers include Jae-Do Nam and Na-Yeon Kim. Their collaborative efforts have further advanced the research and development of materials used in CMP processes.
Conclusion
Donghak Kim's contributions to the field of materials science, particularly through his patented innovations, highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor manufacturing processes.