The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Feb. 26, 2021
Applicants:

Bead Origin Inc., Gyeonggi-do, KR;

Research & Business Foundation Sungkyunkwan University, Gyeonggi-do, KR;

Inventors:

Jae-Do Nam, Seoul, KR;

Na-Yeon Kim, Seoul, KR;

In-Kyung Park, Seoul, KR;

Uiseouk Hwang, Seoul, KR;

Donghak Kim, Busan, KR;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/14 (2006.01); C01F 17/235 (2020.01); C09G 1/02 (2006.01); C09G 1/04 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1409 (2013.01); C01F 17/235 (2020.01); C09G 1/02 (2013.01); C09G 1/04 (2013.01); C09K 3/1463 (2013.01); C01P 2002/04 (2013.01); C01P 2002/85 (2013.01); C01P 2004/60 (2013.01); C01P 2006/10 (2013.01); C01P 2006/40 (2013.01);
Abstract

The inorganic particle according to the present invention is composed of aggregation of crystalline and amorphous small particles and has a spherical and smooth surface. The spherical appearance, low crystallinity and narrow particle size distribution of inorganic particle are more advantageous in reducing scratch defects in the CMP process. In addition, since the small particles on the surface of the inorganic particle provide more active sites, the inorganic particle has an excellent removal rate, so it is advantageous as a next-generation CMP abrasive.


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