Suwon, South Korea

Dongchul Yang

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongchul Yang. Retrieved from https://idiyas.com/inventor/dongchul-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Dongchul Yang

Introduction

Dongchul Yang is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor technology. His innovative work has led to the development of a significant patent that enhances the reliability of semiconductor packages.

Latest Patents

Dongchul Yang holds a patent for a semiconductor package and memory module that includes high reliability signal characteristics. The patent describes a semiconductor package that consists of a package substrate, a semiconductor chip mounted on the substrate, and connection terminals arranged on the lower surface. The connection terminals are structured in a two-dimensional array, allowing for improved signal integrity.

Career Highlights

Yang is currently employed at Samsung Electronics Ltd., a leading company in the electronics industry. His work at Samsung has positioned him as a key player in advancing semiconductor technologies. His patent reflects his commitment to innovation and excellence in his field.

Collaborations

Throughout his career, Dongchul Yang has collaborated with talented individuals such as Seokbeom Yong and Yunhee Lee. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Dongchul Yang's contributions to semiconductor technology exemplify the spirit of innovation. His patent not only showcases his expertise but also highlights the importance of collaboration in achieving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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