The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
May. 27, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seokbeom Yong, Yongin-si, KR;
Dongchul Yang, Suwon-si, KR;
Yunhee Lee, Seoul, KR;
Seungsoo Ha, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided is a semiconductor package with high reliability signal characteristics and a memory module including the semiconductor package. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and connection terminals arranged on a lower surface of the package substrate. The connection terminals are arranged in a two-dimensional array structure in a first direction and a second direction perpendicular to the first direction, and two adjacent terminals with a shortest distance therebetween among data signal (DQ) terminals and command and address signal (CA) terminals included in the connection terminals are arranged in a diagonal direction between the first direction and the second direction.