This inventor holds 1 USPTO granted patent. Top assignee: Polyclad Laminates, Inc.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Innovations by Dong Zhang in Printed Circuit Board Technology
Introduction
Dong Zhang is an accomplished inventor based in Concord, NH (US). He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on enhancing the properties of prepregs and laminates used in electronic applications.
Latest Patents
Dong Zhang holds a patent for the "Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards." This invention is directed towards filled prepregs and laminates that incorporate a reinforcing material impregnated with a cured polymeric resin. The resin includes multicellular polymeric microspheres as a filler, resulting in prepregs and laminates with a reduced dielectric constant as low as 3.0, depending on the resin system used. The benefits of this invention include enhanced electrical, thermal, and mechanical properties, improved machinability, low density, and a uniform appearance.
Career Highlights
Dong Zhang is associated with Polyclad Laminates, Inc., where he applies his expertise in developing advanced materials for the electronics industry. His work has been pivotal in improving the performance and reliability of printed circuit boards.
Conclusion
Dong Zhang's innovative contributions to printed circuit board technology demonstrate his commitment to advancing the field. His patented methods for manufacturing prepregs and laminates are set to make a lasting impact on the electronics industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile