The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2003
Filed:
Nov. 09, 2001
Applicant:
Inventor:
Dong Zhang, Concord, NH (US);
Assignee:
Polyclad Laminates, Inc., West Franklin, NH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 ; H05K 1/00 ;
U.S. Cl.
CPC ...
B32B 3/00 ; H05K 1/00 ;
Abstract
The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin comprising multicellular polymeric microspheres as a filler. Pre-pregs, laminates and printed circuit boards prepared by this method have reduced dielectric constant as low as 3.0, depending upon the resin system of the matrix. In addition, such laminates and printed circuit boards have enhanced electrical, thermal and mechanical properties as well as improved machinability, low density and a uniform appearance.