Dong Won Son

Title: Innovations of Dong Won Son

Introduction

Dong Won Son is a notable inventor based in Incheon Si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of EMI shielding for flip chip packages. With a total of two patents to his name, his work has garnered attention in the industry.

Latest Patents

One of Dong Won Son's latest patents focuses on EMI shielding for flip chip packages with exposed die backsides. This innovative semiconductor device features a substrate with a semiconductor die positioned above it. An encapsulant is applied over the semiconductor die and substrate, leaving the surface of the semiconductor die exposed. A first shielding layer is created over the semiconductor die, which may include a stainless steel layer in contact with the die's surface, topped with a copper layer. Additionally, a protective layer can be formed over the copper layer. In one embodiment, a heatsink is bonded to the semiconductor die through a solder layer, and a second shielding layer can be formed over the side surface of the semiconductor die.

Career Highlights

Dong Won Son is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in semiconductor technology. His expertise in EMI shielding has positioned him as a valuable asset in his field.

Collaborations

He has collaborated with notable coworkers, including Byeonghoon Kim and Sung Ho Choi, contributing to advancements in their shared projects.

Conclusion

Dong Won Son's contributions to semiconductor technology, particularly through his innovative patents, highlight his role as a significant inventor in the industry. His work continues to influence the development of advanced semiconductor devices.