Hwaseong, South Korea

Dong-sik Shim

This inventor holds 34 USPTO granted patents and 1 published patent application, primarily in Optical and Acoustic Devices. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2003-2022.

USPTO Granted Patents = 34 

% Patents Active = 58.8

Average Co-Inventor Count = 3.6

ph-index = 6

Forward Citations = 119(Granted Patents)


Location History:

  • Paldal-gu, KR (2006)
  • Seoul, KR (2003 - 2008)
  • Yongin-si, KR (2010 - 2011)
  • Suwon-si, KR (2007 - 2013)
  • Hwaseong-si, KR (2011 - 2022)

Company Filing History:


Years Active: 2003-2022

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Areas of Expertise:
Optical Integrated Circuit
Capacitive Micromachined Ultrasonic Transducer
Micro Optical Switch
Electro-Acoustic Transducer
Inkjet Printhead
Thermal Inkjet Technology
Schottky Diode
Magnetic Field Sensor
Fluxgate Sensor
RFID Tag
3D Packaging
Photolithography
34 patents (USPTO):Explore Patents

Title: Innovations by Dong-sik Shim: A Pioneer in Optical and Ultrasonic Technologies

Introduction: Dong-sik Shim, based in Hwaseong-si, South Korea, is an accomplished inventor known for his significant contributions to optical integrated circuits and ultrasonic transducers. With a total of 34 patents to his name, Shim has been at the forefront of technological advancements in these fields.

Latest Patents: Among Dong-sik Shim's notable patents are two groundbreaking inventions. The first is the optical integrated circuit device array having bi-directional characteristics and optical system using the same. This innovation features an array of bi-directional optical integrated circuit unit devices that are integrated on a substrate and arranged in a two-dimensional format. Each unit device incorporates a single wavelength laser light source, a bi-directional optical device, and an antenna, all integrated onto the substrate, enabling enhanced optical performance.

The second significant patent is for a capacitive micromachined ultrasonic transducer and the method of fabricating it. This device includes a substrate that defines multiple cavities, a membrane for covering these cavities, and a top electrode connected electrically through a via hole. The transducer is designed to enhance the efficiency of ultrasonic applications, showcasing Shim's expertise in micromechanical systems.

Career Highlights: Dong-sik Shim is currently employed at Samsung Electronics Co., Ltd., where he engages in pioneering research and development. His work in optical and ultrasonic technologies has positioned him as a leading figure in the innovation landscape, contributing to projects that have a lasting impact on the electronics industry.

Collaborations: Throughout his career, Shim has collaborated with notable peers such as Hyung Ki Choi and Yong-seop Yoon. These collaborations have fostered an environment of innovation and creativity, allowing for the development of advanced technologies that benefit a wide range of applications.

Conclusion: Dong-sik Shim's commitment to innovation is reflected in his substantial patent portfolio and collaborative efforts within Samsung Electronics Co., Ltd. His contributions to optical and ultrasonic technologies have set new standards, ensuring that his work will continue to influence future developments in these crucial fields.

Profile summary based on public USPTO records.
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