This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: The Innovative Contributions of Dong-ru Wu
Dong-ru Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging through his innovative designs and methods. His work has been recognized in the industry, particularly for its practical applications in chip packaging.
Latest Patents
Dong-ru Wu holds a patent for a "Chip package structure and method for fabricating the same." This invention provides a chip package structure that includes a conductive substrate, a chip, a molding layer, and a package cover. The conductive substrate features first and second board surfaces that are opposite to each other, with a die-bonding region defined on the first board surface. The chip is positioned on the first board and is located within the die-bonding region, ensuring electrical connectivity to the conductive substrate. The molding layer surrounds the die-bonding region and the chip, while the package cover is placed on top of the molding layer. Together, these components create an enclosed space around the chip, with two of the conductive substrate, molding layer, and package cover connected through a mortise-tenon joint structure. This innovative design enhances the reliability and performance of electronic devices.
Career Highlights
Dong-ru Wu is currently employed at Tong Hsing Electronic Industries, Ltd., where he continues to develop cutting-edge technologies in the field of electronics. His expertise in chip packaging has positioned him as a valuable asset to the company and the industry at large.
Collaborations
Throughout his career, Dong-ru Wu has collaborated with talented individuals such as Chien-Chen Lee and Li-Chun Hung. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
In summary, Dong-ru Wu is a distinguished inventor whose contributions to chip packaging technology have made a significant impact in the electronics industry. His innovative patent and collaborative efforts highlight his commitment to advancing technology and improving electronic device performance.