Seoul, South Korea

Dong Chun Lee

This inventor holds 5 USPTO granted patents. Top assignee: Mirae Corporation. Active years: 2002-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Chun Lee. Retrieved from https://idiyas.com/inventor/dong-chun-lee-n5qp10ze

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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5 patents (USPTO):Explore Patents

Title: Innovations of Dong Chun Lee

Introduction

Dong Chun Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of module integrated circuit (IC) handling. With a total of five patents to his name, Lee's work focuses on improving the efficiency and reliability of module IC testing processes.

Latest Patents

One of Lee's latest patents is titled "Method and apparatus for circulating pallets in an elevator unit of the module IC handler." This invention describes a module IC handler that facilitates loading and unloading operations for module ICs without the need to elevate the pallet over an installation plate. The handler allows for sequential transferring operations for the pallet, which holds the test or customer tray. After all module ICs are loaded or filled into the customer tray, the pallet can be rotated and circulated to the upper side of the loading or unloading elevation plate.

Another notable patent is the "Method for handling a module IC and a carrier of a module IC handler." This method enhances the transfer of carriers containing multiple module ICs between processes while conducting tests on the ICs. By performing tests on the module ICs contained in the carrier, the reliability of the discharged product is improved, and the operational efficiency of high-cost testing apparatuses is maximized.

Career Highlights

Dong Chun Lee is currently employed at Mirae Corporation, where he continues to innovate in the field of module IC handling. His work has been instrumental in advancing the technology used in testing and handling module ICs, contributing to the overall efficiency of the industry.

Collaborations

Lee collaborates with talented coworkers, including Sang Soo Lee and Jong Won Kim. Their combined expertise fosters a creative environment that drives innovation within their projects.

Conclusion

Dong Chun Lee's contributions to the field of module IC handling through his patents demonstrate his commitment to innovation and efficiency. His work not only enhances the reliability of testing processes but also sets a standard for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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