The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Nov. 29, 1999
Sang Soo Lee, Choongchungnam-do, KR;
Wan Gu Lee, Choongchungnam-do, KR;
Jong Won Kim, Kyungki-do, KR;
Hee Soo Kim, Kyungki-do, KR;
Young Hak Oh, Kyungki-do, KR;
Dong Chun Lee, Seoul, KR;
Mirae Corporation, Choongchungnam-do, KR;
Abstract
A carrier handling apparatus of an IC module handler includes a carrier transferring unit for holding one side of the carrier to transfer the same between the various processes, and a carrier positioning unit for precisely positioning the carrier. The carrier handling apparatus includes a carrier for transferring predetermined modules, a carrier transferring unit for transferring the carrier from a loading location to an unloading location, and a carrier positioning unit for precisely positioning the carrier in the loading and unloading locations, thereby allowing IC modules contained in a tray to be accurately loaded into the carrier or unloaded therefrom by a pick-up means. According to another aspect of the present invention, a slider is installed to be moved along the traveling path of the carrier, and is provided with a pair of fingers that can be withdrawn or spread by one cylinder, so that the area required to install the carrier transferring apparatus can be minimized. Further, since the carrier is accurately positioned before the pick-up means loads and unloads the IC modules in the loading and unloading locations, any troubles which may be caused due to position inaccuracies during the loading and unloading of the IC modules can be prevented in advance, thereby maximizing the operation rate of the apparatus.