Colorado Springs, CO, United States of America

Donald Earl Schott

This inventor holds 3 USPTO granted patents. Top assignees: Agilent Technologies, Inc., Hewlett-Packard Company. Active years: 1995-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald Earl Schott. Retrieved from https://idiyas.com/inventor/donald-earl-schott

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 33.3

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 1995-2006

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3 patents (USPTO):Explore Patents

Title: The Innovations of Donald Earl Schott

Introduction

Donald Earl Schott is a notable inventor based in Colorado Springs, CO. He has made significant contributions to the field of electrical engineering, particularly in the development of advanced testing methods and packaging technologies. With a total of 3 patents to his name, Schott's work has had a lasting impact on the industry.

Latest Patents

One of Schott's latest patents is the "Interposer probe and method for testing." This invention features an interposer probe that includes a main board with a first side and a second side. A lower riser board is mounted to the first side of the main board and is in electrical contact with it, allowing it to engage an integrated circuit socket on a device to be tested. Additionally, an upper riser board is mounted to the second side of the main board and is configured to receive an integrated circuit package. A retention frame on the first side of the main board secures the integrated circuit socket during testing.

Another significant patent is the "Method and apparatus for high electrical and thermal performance ball grid array package." This invention presents a thick film ceramic ball grid array package that offers high electrical and thermal performance. It features a laser cut die cavity and may include a heat spreader or heat sink on the second side of the ceramic substrate. An integrated circuit die can be attached to the heat spreader or heat sink through the die cavity and wire bonded to pads on the first side of the substrate.

Career Highlights

Throughout his career, Donald Earl Schott has worked with prominent companies such as Agilent Technologies, Inc. and Hewlett-Packard Company. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Schott has collaborated with several talented individuals in the field, including Jimmie Doyle Felps and Frank P. Leri. These collaborations have further enriched his work and led to advancements in technology.

Conclusion

Donald Earl Schott's contributions to electrical engineering and his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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