The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2005
Filed:
Jan. 30, 2004
Donald E. Schott, Colorado Springs, CO (US);
Andrew Grieder, Larkspur, CO (US);
Joseph P. Groshong, Colorado Springs, CO (US);
Donald E. Schott, Colorado Springs, CO (US);
Andrew Grieder, Larkspur, CO (US);
Joseph P. Groshong, Colorado Springs, CO (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film ceramic substrate with a first side and a second side with a heat spreader or a heat sink on the second side. An IC die may be attached to the heat spreader or heat sink through the laser cut die cavity and wire bonded to pads on the first side of the ceramic substrate. The thick film ceramic substrate may have one or more integrated passive components.