Company Filing History:
Years Active: 2004-2005
Title: The Innovations of Andrew Grieder
Introduction
Andrew Grieder is an accomplished inventor based in Larkspur, Colorado. He has made significant contributions to the field of electrical and thermal performance packaging. With a total of two patents to his name, Grieder's work is recognized for its innovative approaches to technology.
Latest Patents
Grieder's latest patents include a "Method and apparatus for high electrical and thermal performance ball grid array package." This invention presents a high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity. The design features a thick film ceramic substrate with a heat spreader or heat sink on one side, allowing for efficient thermal management. Additionally, he holds a patent for "High temperature eutectic solder ball attach," which involves controlling the collapse of eutectic solder balls during reflow heating to ensure proper solder ball standoff and coplanarity.
Career Highlights
Andrew Grieder is currently employed at Agilent Technologies, Inc., where he continues to innovate in the field of electronic packaging. His work has contributed to advancements in the reliability and performance of electronic components.
Collaborations
Grieder has collaborated with notable coworkers, including Alexander Lazar and Donald Earl Schott, who have also contributed to the field of technology and innovation.
Conclusion
Andrew Grieder's contributions to the field of electrical and thermal performance packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of technology and its applications in modern electronics.