The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2004

Filed:

Oct. 21, 2002
Applicant:
Inventors:

Andrew Grieder, Larkspur, CO (US);

Alexander Lazar, Stuttgart, DE;

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; H01L 2/348 ;
U.S. Cl.
CPC ...
B23K 3/102 ; H01L 2/348 ;
Abstract

High melt balls dispersed on the surface of a ball grid array package in such a manner that the collapse of eutectic solder balls is controlled during reflow heating in order to ensure appropriate solder ball standoff, pitch and coplanarity of the ball grid array package from the substrate or printed circuit board surface to which it is being attached.


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