Company Filing History:
Years Active: 2018-2025
Title: Innovations of Donald A. Clay
Introduction
Donald A. Clay is an accomplished inventor based in Boxborough, MA (US). He holds 2 patents that showcase his expertise in integrated circuit design. His work has significantly contributed to advancements in semiconductor technology.
Latest Patents
One of his latest patents is titled "Through silicon via macro with dense layout for placement in an integrated circuit floorplan." This patent describes a system and method for efficiently designing through silicon via (TSV) macro blocks. The circuitry of a processor executes instructions from a place and route tool that automatically places macro blocks and standard cells on an integrated circuit die. The processor strategically places two functional macros in the floorplan with a channel between them, ensuring optimal layout and functionality.
Another notable patent is "Integrated circuit implementing standard cells with metal layer segments extending out of cell boundary." This computer-implemented method involves selecting a first cell from a standard cell library, which includes a metal segment extending beyond the cell boundary. The method further details the placement of a second cell in relation to the first, enhancing the overall design of the integrated circuit structure.
Career Highlights
Donald A. Clay has worked with prominent companies in the technology sector, including Advanced Micro Devices Corporation and ATI Technologies. His experience in these organizations has allowed him to refine his skills and contribute to significant projects in the field of integrated circuits.
Collaborations
Throughout his career, Donald has collaborated with talented individuals such as Omid Rowhani and Ioan Cordos. These partnerships have fostered innovation and creativity in his work.
Conclusion
Donald A. Clay is a notable inventor whose contributions to integrated circuit design have made a lasting impact on the technology industry. His patents reflect his commitment to innovation and excellence in engineering.