Don Brown

Title: Don Brown - Innovator in Wafer Processing Technology

Introduction

Don Brown is a notable inventor based in Bedford, Texas. He has made significant contributions to the field of wafer processing technology. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of wafer separation.

Latest Patents

Don Brown holds a patent for a "Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer." This invention involves a sophisticated mechanism that separates a wafer into portions using a larger flex-frame supported on a base and a smaller flex-frame positioned within it. The design includes a wafer film transfer cylinder that encompasses a wafer breaking device, facilitating the transfer of the wafer from one frame to another. The transfer cylinder is heated to aid in the removal of saw tape, making the process more efficient and suitable for automated wafer transfer carriers.

Career Highlights

Don Brown is associated with Texas Instruments Corporation, where he has applied his expertise in wafer processing. His work has contributed to advancements in the manufacturing and packaging of semiconductor devices. With a focus on innovation, he has been instrumental in developing technologies that streamline production processes.

Collaborations

Throughout his career, Don has collaborated with esteemed colleagues, including Robert G McKenna and David Durin. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Don Brown's contributions to wafer processing technology exemplify the spirit of innovation. His patent and work at Texas Instruments Corporation highlight his commitment to advancing the field. His efforts continue to influence the industry and pave the way for future developments.