The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2004
Filed:
Nov. 20, 1997
Robert G. McKenna, Houston, TX (US);
David Durin, Rowlett, TX (US);
Don Brown, Bedford, TX (US);
Cecil Davis, Greenville, TX (US);
John Jones, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method and apparatus for separating a wafer into wafer portions comprising a larger wafer flex-frame ( ) supported on a support base ( ) and a smaller flex-frame ( ) positioned within the support base ( ). A wafer film transfer cylinder ( ) encompasses a wafer breaking device ( ), such as a convex dome. The transfer cylinder ( ) is slidable downwardly with respect to the dome ( ) to first stretch the wafer tape ( ) and then transfer the wafer ( ) from the larger frame ( ) to the smaller frame ( ) after dome ( ) breaks the wafer ( ) into die. The transfer cylinder ( ) is heated to facilitate removing the saw tape ( ) from the larger frame ( ) after transfer to the smaller frame ( ). The transfer cylinder ( ) is juxtaposed with the smaller frame ( ) residing within a cavity ( ) of the support base ( ). The present invention is suited for automated wafer transfer carriers which advance the broken wafer to pick and place equipment for packaging of the die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile