David Durin

Title: David Durin - Innovator in Wafer Processing Technology

Introduction

David Durin is a notable inventor based in Rowlett, Texas. He has made significant contributions to the field of wafer processing technology. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of wafer separation.

Latest Patents

David Durin holds a patent for a "Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer." This invention involves a sophisticated mechanism that separates a wafer into portions using a larger flex-frame supported on a base and a smaller flex-frame positioned within it. The design includes a wafer film transfer cylinder that encompasses a wafer breaking device, facilitating the transfer of the wafer from one frame to another. The transfer cylinder is heated to aid in the removal of the saw tape, making it particularly suited for automated wafer transfer carriers.

Career Highlights

David Durin is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in improving processes related to wafer handling and processing.

Collaborations

Throughout his career, David has collaborated with esteemed colleagues, including Robert G. McKenna and Don Brown. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

David Durin's contributions to wafer processing technology exemplify the spirit of innovation. His patent and ongoing work at Texas Instruments Corporation highlight his commitment to advancing the field. His collaborations with other professionals further enhance the impact of his inventions.