This inventor holds 1 USPTO granted patent. Top assignee: Avantek, Inc.. Active years: 1992.
Company Filing History:
Years Active: 1992
Title: The Innovations of Ding Y Day
Introduction
Ding Y Day is a notable inventor based in Sunnyvale, CA (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to wafer thinning processes.
Latest Patents
Ding Y Day holds a patent for a "Rapid wafer thinning process." This method provides a technique for thinning a Gallium Arsenide (GaAs) layer on the backside of a wafer substrate. The process involves spraying an etchant solution that includes NH.sub.4 OH and H.sub.2 O.sub.2, preferably in a 1:4 ratio, onto the GaAs layer while the wafer is rotated at approximately 2000 rpm. The etchant is sprayed through multiple nozzles, allowing for efficient thinning of the GaAs layer by about 500 μm in approximately 14 to 18 minutes, depending on the etchant's temperature and composition. Ding Y Day has 1 patent to his name.
Career Highlights
Ding Y Day has worked at Avantek, Inc., where he has been instrumental in advancing semiconductor manufacturing techniques. His expertise in wafer processing has positioned him as a valuable asset in the industry.
Collaborations
Ding Y Day has collaborated with Chang-Hwang Hua, further enhancing the innovative capabilities within their field. Their partnership has contributed to the development of advanced technologies in semiconductor processing.
Conclusion
Ding Y Day's contributions to the field of semiconductor technology through his innovative patent demonstrate his commitment to advancing manufacturing processes. His work continues to influence the industry positively.