Ragama, Sri Lanka

Dimantha Rajapaksa

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Applied Materials, Inc.. Active years: 2019-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dimantha Rajapaksa. Retrieved from https://idiyas.com/inventor/dimantha-rajapaksa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 6.8

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2019-2023

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3 patents (USPTO):Explore Patents

Title: Dimantha Rajapaksa - Innovative Inventor from Ragama, LK

Introduction: Dimantha Rajapaksa is a talented inventor hailing from Ragama, Sri Lanka, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Dimantha Rajapaksa holds several patents in the areas of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his diverse range of interests and expertise.

Career Highlights: With a background in engineering and a passion for problem-solving, Dimantha Rajapaksa has successfully developed cutting-edge solutions that have revolutionized various industries. His commitment to innovation has earned him recognition as a thought leader in the inventor community.

Collaborations: Throughout his career, Dimantha Rajapaksa has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Dimantha Rajapaksa's relentless pursuit of innovation and his dedication to creating a positive impact on society through his inventions make him a true pioneer in the world of technology. His work continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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