This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2005.
Company Filing History:
Years Active: 2005
Title: The Innovations of Dilip K Misra
Introduction
Dilip K Misra is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging through his innovative patents. His work primarily focuses on enhancing the performance and reliability of wire-bonding substrates.
Latest Patents
Dilip K Misra holds a patent titled "Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same." This patent describes a wire-bonding substrate that includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding on the first side of the substrate and a land pad for a ball attach on the second side of the substrate. The patent also discloses a process for forming the surface finish, an electronic package that utilizes the surface finish, and a method for assembling an electronic package that incorporates the surface finish on the wire-bonding substrate.
Career Highlights
Dilip K Misra is currently employed at Intel Corporation, where he continues to innovate and contribute to advancements in technology. His work has been instrumental in improving the efficiency and effectiveness of electronic components.
Collaborations
Some of his notable coworkers include Dale A Hackitt and Brian Taggert, who have collaborated with him on various projects within the company.
Conclusion
Dilip K Misra's contributions to the field of electronic packaging through his innovative patents highlight his expertise and dedication to advancing technology. His work continues to influence the industry and pave the way for future innovations.