Fremont, CA, United States of America

Diane Peng


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovations of Diane Peng

Introduction

Diane Peng is an accomplished inventor based in Fremont, CA. She has made significant contributions to the field of technology, particularly in the area of lead frame packages. With one patent to her name, Diane has demonstrated her innovative spirit and technical expertise.

Latest Patents

Diane's patent focuses on a lead frame package that enhances the coupling of transmission signals into a die. This design utilizes bonding wires that are strategically separated by no more than three times the diameter of one of the bonding wires. In certain embodiments, pairs of lead frames carrying differential transmission signals are shielded by adjacent pairs of ground and power leads, which are also coupled into the die through bonding wires with the same separation criteria.

Career Highlights

Diane currently works at Integrated Device Technology, Inc., where she continues to push the boundaries of innovation. Her work has been instrumental in developing advanced packaging solutions that improve signal integrity and performance in electronic devices.

Collaborations

Diane collaborates with talented professionals in her field, including David J. Pilling and Jitesh Shah. Their combined expertise fosters a creative environment that drives technological advancements.

Conclusion

Diane Peng's contributions to the field of technology through her innovative lead frame package patent exemplify her dedication to advancing electronic design. Her work at Integrated Device Technology, Inc. continues to influence the industry positively.

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