The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2012

Filed:

Aug. 05, 2008
Applicants:

David J. Pilling, Los Altos Hills, CA (US);

Jitesh Shah, Fremont, CA (US);

Diane Peng, Fremont, CA (US);

Derek Huang, San Jose, CA (US);

Inventors:

David J. Pilling, Los Altos Hills, CA (US);

Jitesh Shah, Fremont, CA (US);

Diane Peng, Fremont, CA (US);

Derek Huang, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead frame package is disclosed where transmission signals are coupled into a die from a pair of lead frames through bonding wires that are separated by no more than three times a diameter of one of the bonding wires. In some embodiments, pairs of lead frames carrying differential transmission signals can be shielded by adjacent pairs of ground and power leads that are coupled into the die through bonding wires that are also separated by no more than three times a diameter of one of the bonding wires.


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