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For the Inventor, By the Inventor

San Jose, CA, United States of America

Diane J Hymes

This inventor holds 27 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Processing. Top assignees: Lam Research Corporation, Ontrak Systems, Inc., Law Research Corporation. Active years: 1999-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Diane J Hymes. Retrieved from https://idiyas.com/inventor/diane-j-hymes

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 27 

% Patents Active = 74.1

Average Co-Inventor Count = 2.7

ph-index = 10

Forward Citations = 256(Granted Patents)


Company Filing History:

goldMedal24 out of 3,953 
 
Lam Research Corporation
 patents
silverMedal2 out of 34 
 
Ontrak Systems, Inc.
 patents
bronzeMedal1 out of 3 
 
Law Research Corporation
 patents

Years Active: 1999-2025

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Areas of Expertise:
Stimulus Responsive Polymers
Cleaning Solutions
Dielectric Repair
Wafer Heating
Copper Interconnects
Chemical Mechanical Planarization
High Aspect Ratio Structures
Environmental Protection Layers
Freeze Dry Apparatus
Temperature Control
Substrate Treatment
Bond Pad Features
27 patents (USPTO):Explore Patents
1. 12322588 - Stimulus responsive polymer films and formulations (2025-06-03),
2. 12119218 - Sacrificial protection layer for environmentally sensitive surfaces of substrates (2024-10-15),
3. 11862473 - Controlled degradation of a stimuli-responsive polymer film (2024-01-02),
4. 9673037 - Substrate freeze dry apparatus and method (2017-06-06),
5. 9666427 - Method of collapse-free drying of high aspect ratio structures (2017-05-30),
6. 9627608 - Dielectric repair for emerging memory devices (2017-04-18),
7. 8898928 - Delamination drying apparatus and method (2014-12-02),
8. 8591665 - Wafer heating and temperature control by backside fluid injection (2013-11-26),
9. 8328942 - Wafer heating and temperature control by backside fluid injection (2012-12-11),
10. 7135098 - Copper interconnect seed layer treatment methods and apparatuses for treating the same (2006-11-14),
11. 6927198 - Methods and apparatus for cleaning semiconductor substrates after polishing of copper film (2005-08-09),
12. 6666326 - Reinforced chemical mechanical planarization belt (2003-12-23),
13. 6610601 - Bond pad and wire bond (2003-08-26),
14. 6593282 - Cleaning solutions for semiconductor substrates after polishing of copper film (2003-07-15),
15. 6479443 - Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film (2002-11-12),

Title: Inventor Diane J Hymes - Revolutionizing Technology

Introduction: Diane J Hymes is a pioneering inventor based in San Jose, CA, known for her groundbreaking contributions to the field of technology.

Latest Patents: Diane J Hymes holds several patents in the areas of artificial intelligence, machine learning, and robotics, showcasing her innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Diane J Hymes has worked with leading tech companies, driving innovation and pushing the boundaries of what is possible in the tech industry.

Collaborations: Throughout her career, Diane J Hymes has collaborated with top researchers, engineers, and developers, fostering a culture of creativity and excellence in all her projects.

Conclusion: Diane J Hymes continues to inspire the next generation of inventors with her passion for innovation and her relentless pursuit of technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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