Liaoning, China

Di Feng

This inventor holds 1 USPTO granted patent. Top assignee: Dalian University of Technology. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Di Feng. Retrieved from https://idiyas.com/inventor/di-feng-mt2bigq2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Di Feng in 3D Measurement Technology

Introduction

Di Feng is a notable inventor based in Liaoning, China. He has made significant contributions to the field of 3D measurement technology. His innovative work focuses on enhancing the precision of spatial measurements through advanced calibration methods.

Latest Patents

Di Feng holds a patent for a "3D measurement model and spatial calibration method based on 1D displacement sensor." This invention proposes a 3D measurement system utilizing a fixed 1D displacement sensor. The patent outlines a spatial measurement model that addresses inaccuracies caused by sensor extrinsic parameters. By employing weighted iterative algorithms, the calibration process ensures high precision in 3D measurements.

Career Highlights

Di Feng is affiliated with Dalian University of Technology, where he continues to advance research in measurement technologies. His work has garnered attention for its practical applications in various industries. With 1 patent to his name, he is recognized for his innovative approach to solving complex measurement challenges.

Collaborations

Di Feng collaborates with esteemed colleagues such as Wei Liu and Bing Liang. Their combined expertise contributes to the development of cutting-edge measurement solutions.

Conclusion

Di Feng's contributions to 3D measurement technology exemplify the impact of innovative thinking in engineering. His work not only enhances measurement precision but also addresses critical challenges in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…