Yucaipa, CA, United States of America

Devin Paul Anderson

This inventor holds 1 USPTO granted patent. Top assignee: Honeybee Robotics, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Devin Paul Anderson. Retrieved from https://idiyas.com/inventor/devin-paul-anderson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Devin Paul Anderson and Aerospace Payload Unloading

Introduction

Devin Paul Anderson is an inventor associated with Yucaipa, California, and Honeybee Robotics, Ltd. His work includes a patented system designed to unload payloads from an aerospace landing vehicle. The available information identifies 1 patent associated with him.

Latest Patents

Anderson’s listed patent is titled “System and Method of Unloading a Payload from an Aerospace Landing Vehicle.” It describes a cargo unloading system that can be coupled to an aerospace landing vehicle. A carriage supports at least one pivoting main arm, which connects to a sliding linear arm and an end effector. A bidirectional rotation mechanism links the carriage to the main arm, enabling the system to move and handle a payload during unloading.

Career Highlights

Anderson is associated with Honeybee Robotics, Ltd., a company whose work includes robotics and aerospace technologies. His listed patent focuses on a mechanical approach to transferring cargo from a landing vehicle.

Collaborations

The provided information names Vishnu Sanigepalli and Brian David Vogel as Anderson’s coworkers. Their shared association with Honeybee Robotics, Ltd. places them within the same professional context, though specific joint work is not detailed.

Conclusion

Devin Paul Anderson’s listed invention addresses the practical challenge of unloading cargo from an aerospace landing vehicle through a system of articulated and sliding components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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