Fort Washington, PA, United States of America

Devesh Sharma

This inventor holds 1 USPTO granted patent. Top assignee: Kulicke and Soffa Industries, Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Devesh Sharma. Retrieved from https://idiyas.com/inventor/devesh-sharma-vknuwbr1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Devesh Sharma: Innovator in Wedge Bonding Technology

Introduction

Devesh Sharma is a notable inventor based in Fort Washington, PA (US). He has made significant contributions to the field of wedge bonding technology, particularly through his innovative patent that enhances the precision of bonding machines.

Latest Patents

Devesh Sharma holds a patent titled "Methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines." This patent outlines a method for determining the cutter height on a wedge bonding machine. The process involves several steps, including lowering a wedge bonding tool toward a surface, measuring the height when the tool contacts the surface, and subsequently determining the cutter height based on these measurements. This innovation is crucial for improving the accuracy and efficiency of wedge bonding operations.

Career Highlights

Devesh Sharma is currently employed at Kulicke and Soffa Industries, Inc., where he continues to develop and refine technologies related to wedge bonding. His work has positioned him as a key player in the advancement of bonding machine technology.

Collaborations

Devesh collaborates with Eric T. Scranton, leveraging their combined expertise to drive innovation within their field.

Conclusion

Devesh Sharma's contributions to wedge bonding technology through his patent demonstrate his commitment to innovation and excellence in engineering. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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