The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

May. 19, 2022
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventors:

Peter Julius Klaerner, Fort Washington, PA (US);

Eric T. Scranton, Fort Washington, PA (US);

Karthik Gundappa Balte, Fort Washington, PA (US);

Jose De Jesus Lozano De Alva, Fort Washington, PA (US);

Devesh Sharma, Fort Washington, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B26D 7/26 (2006.01); B23K 20/02 (2006.01); B23K 20/26 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B26D 7/2628 (2013.01); B23K 20/02 (2013.01); B23K 20/26 (2013.01); B23K 2101/42 (2018.08);
Abstract

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.


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