Victoria, Australia

Desmond Lau

This inventor holds 1 USPTO granted patent. Top assignee: The University of Melbourne. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Desmond Lau. Retrieved from https://idiyas.com/inventor/desmond-lau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Desmond Lau: Innovator in Diamond Membrane Fabrication

Introduction

Desmond Lau is a notable inventor based in Victoria, Australia. He has made significant contributions to the field of material science, particularly in the fabrication of diamond membranes. His innovative approach has the potential to impact various applications in technology and engineering.

Latest Patents

Desmond Lau holds a patent for a "Method of fabricating a diamond membrane." This patent outlines a process that involves providing a substrate made of diamond material, which has a first surface and a sub-surface layer with a different crystallographic structure. The method includes selectively removing a second region of the diamond material by etching away part of the sub-surface layer, thereby creating a functional diamond membrane.

Career Highlights

Desmond Lau is affiliated with The University of Melbourne, where he continues to advance his research and innovation in material sciences. His work has garnered attention for its potential applications in various high-tech industries.

Collaborations

Desmond has collaborated with notable colleagues such as Afaq Habib Piracha and Steven Prawer. Their combined expertise contributes to the advancement of research in diamond materials and their applications.

Conclusion

Desmond Lau's innovative work in the fabrication of diamond membranes showcases his commitment to advancing material science. His contributions are paving the way for future developments in technology and engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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