The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Oct. 15, 2015
Applicant:

The University of Melbourne, Victoria, AU;

Inventors:

Afaq Habib Piracha, Victoria, AU;

Steven Prawer, Victoria, AU;

Kumaravelu Ganesan, Victoria, AU;

Snjezana Tomljenovic-Hanic, Victoria, AU;

Desmond Lau, Victoria, AU;

Assignee:

The University of Melbourne, Melbourne, Victoria, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 25/68 (2006.01); C03C 25/00 (2018.01); B23P 15/00 (2006.01); C23F 1/00 (2006.01); C30B 25/20 (2006.01); C30B 25/04 (2006.01); C30B 29/04 (2006.01); C30B 25/18 (2006.01); C23C 16/04 (2006.01); C23C 16/27 (2006.01); B23K 26/00 (2014.01); B23K 26/362 (2014.01); B81C 3/00 (2006.01); C23C 16/44 (2006.01); C23C 16/56 (2006.01); C25F 3/02 (2006.01); C30B 33/10 (2006.01); C30B 33/12 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C30B 25/20 (2013.01); B23K 26/0006 (2013.01); B23K 26/362 (2013.01); B81C 3/001 (2013.01); C23C 16/042 (2013.01); C23C 16/274 (2013.01); C23C 16/279 (2013.01); C23C 16/4408 (2013.01); C23C 16/56 (2013.01); C25F 3/02 (2013.01); C30B 25/04 (2013.01); C30B 25/18 (2013.01); C30B 29/04 (2013.01); C30B 33/10 (2013.01); C30B 33/12 (2013.01); B23K 2203/50 (2015.10); B81C 2201/0143 (2013.01); B81C 2201/0146 (2013.01); B81C 2201/0187 (2013.01); B81C 2201/0198 (2013.01);
Abstract

The present disclosure provides a method of fabricating a diamond membrane. The method comprises providing a substrate and a support structure. The substrate comprises a diamond material having a first surface and the substrate further comprises a sub-surface layer that is positioned below the first surface and has a crystallographic structure that is different to that of the diamond material. The sub-surface layer is positioned to divide the diamond material into first and second regions wherein the first region is positioned between the first surface and the sub-surface layer. The support structure also comprises a diamond material and is connected to, and covers a portion of, the first surface of the substrate. The method further comprises selectively removing the second region of the diamond material from the substrate by etching away at least a portion of the sub-surface layer of the substrate.


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