Der-Jen Sun

Title: The Innovations of Der-Jen Sun

Introduction

Der-Jen Sun is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced adhesive formulations and polyimide resins. With a total of two patents to his name, his work has had a considerable impact on the manufacturing of flexible printed circuits.

Latest Patents

Der-Jen Sun's latest patents include an epoxy resin adhesive for flexible printed circuits. This innovative adhesive formulation improves the bonding strength of laminates without compromising flexibility. The formulation consists of one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers. His second patent involves a polyimide resin for cast on copper laminate, which exhibits excellent thermal stability and adhesion to metal foils. This polyimide resin is created by dissolving at least one diamine in a polar aprotic solvent, followed by the addition of an aromatic tetracarboxylic acid dianhydride. The resulting polyamic acid solution is then imidized to form a polyimide resin, which can be used to produce flexible printed circuit boards.

Career Highlights

Throughout his career, Der-Jen Sun has worked with prominent companies such as Wirex Corporation and Du Pont Wirex Ltd. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and materials development.

Collaborations

Der-Jen Sun has collaborated with notable colleagues, including Chien-Hwa Chiu and Yen-Huey Hsu. These partnerships have contributed to the advancement of his research and innovations in the field.

Conclusion

Der-Jen Sun's contributions to adhesive formulations and polyimide resins have positioned him as a key figure in materials science. His patents reflect a commitment to innovation and excellence in the development of technologies for flexible printed circuits.