The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Sep. 02, 1999
Applicant:
Inventors:
Chien-Hwa Chiu, Hsinchu, TW;
Der-Jen Sun, Hsinchu, TW;
Ya-Fen Tsai, Hsinchu, TW;
Chien-Yu Chen, Hsinchu, TW;
Assignee:
Du Pont Wirex Ltd, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/34 ; C08L 6/302 ;
U.S. Cl.
CPC ...
C08K 3/34 ; C08L 6/302 ;
Abstract
Epoxy resin adhesive formulations are disclosed which improve the bonding strength of laminates without loss of flexibility. These epoxy resin adhesive formulations comprise one or more epoxy resins, rubber compounds, curing compounds, a hindered piperidinyloxy compound, and optionally one or more fillers.