The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2000

Filed:

Jan. 15, 1999
Applicant:
Inventors:

Chien-Hwa Chiu, Hsinchu, TW;

Der-Jen Sun, Hsinchu, TW;

Yen-Huey Hsu, Hsinchu, TW;

Fu-Ti Shiang, Hsinchu, TW;

Chien-Hsiang Chen, Hsinchu, TW;

Paul S Wu, Hsinchu, TW;

Assignee:

Wirex Corporation, Hasinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; B32B / ;
U.S. Cl.
CPC ...
528353 ; 528125 ; 528128 ; 528170 ; 528172 ; 528173 ; 528183 ; 528185 ; 528220 ; 528229 ; 528350 ; 428209 ; 4284111 ; 428458 ; 4284735 ; 428457 ;
Abstract

A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.


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