Fu-Ti Shiang

Title: Fu-Ti Shiang: Innovator in Polyimide Resin Technology

Introduction

Fu-Ti Shiang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of polyimide resins. His innovative work has led to advancements in flexible printed circuit board technology.

Latest Patents

Fu-Ti Shiang holds a patent for a polyimide resin designed for use in copper laminates. This resin exhibits excellent thermal stability and strong adhesion to metal foils. The preparation process involves dissolving at least one diamine in a polar aprotic solvent, followed by the addition of an aromatic tetracarboxylic acid dianhydride. The resulting polyamic acid solution is then imidized by heating above 250 degrees Celsius, with the polar aprotic solvent containing at least 1 weight percent of acetone. The resulting polyimide laminates can be utilized in the production of flexible printed circuit boards.

Career Highlights

Fu-Ti Shiang is currently employed at Wirex Corporation, where he continues to innovate in the field of materials science. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

He has collaborated with notable colleagues, including Chien-Hwa Chiu and Der-Jen Sun, contributing to various projects that push the boundaries of technology in their field.

Conclusion

Fu-Ti Shiang's contributions to polyimide resin technology have made a significant impact on the electronics industry. His innovative approach and dedication to research continue to inspire advancements in flexible circuit board applications.