Suwon, South Korea

Deok Suk Jang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Deok Suk Jang. Retrieved from https://idiyas.com/inventor/deok-suk-jang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Deok Suk Jang

Introduction

Deok Suk Jang is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of methods that enhance the performance and reliability of semiconductor packages.

Latest Patents

One of his key patents is titled "Method of reducing warpage of semiconductor package substrate and device for reducing warpage." This patent focuses on a method that effectively reduces warpage in semiconductor package substrates. The process involves preparing the substrate, heating it, forming bends, and then cooling it to maintain its integrity. This innovation is crucial for improving the functionality of semiconductor devices.

Career Highlights

Deok Suk Jang is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with some of the brightest minds in the field. His contributions have been instrumental in advancing semiconductor technologies.

Collaborations

He has worked alongside talented colleagues such as Seung Wan Kim and Jeong Ho Yeo. Their collaborative efforts have led to significant advancements in semiconductor packaging techniques.

Conclusion

Deok Suk Jang's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in the industry. His patent on reducing warpage in semiconductor packages showcases his commitment to enhancing technology. His contributions continue to influence the field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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