The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Nov. 17, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/67 (2006.01); H01L 23/48 (2006.01); H01L 23/13 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/4846 (2013.01); H01L 21/67092 (2013.01); H01L 23/13 (2013.01); H01L 23/481 (2013.01); H01L 23/5389 (2013.01); H01L 24/20 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/211 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Embodiments disclosed are directed to a method of reducing warpage of a semiconductor package substrate, and a warpage reducing device. The method includes preparing the semiconductor package substrate, heating the prepared semiconductor package substrate, forming at least one bend in the heated semiconductor package substrate, and cooling the semiconductor package substrate having the at least one bend is formed.