Deok Hoon Kim

Title: Deok Hoon Kim: Innovator in Functional Fibers and Electronic Device Packaging

Introduction

Deok Hoon Kim is a prominent inventor based in Tempe, AZ (US), known for his contributions to the fields of functional fibers and electronic device packaging. With a total of five patents to his name, Kim has made significant advancements that enhance the functionality and efficiency of electronic components.

Latest Patents

Among his latest patents, Kim has developed a functional fiber and a fiber aggregate designed to realize various functions. This innovation includes an adhesive that facilitates the bonding of electronic components, showcasing a method for manufacturing these materials. The fiber is extended in a length direction and comprises a carrier polymer embedded with a plurality of functional particles, which are physically fixed to the carrier polymer for integration.

Another notable patent involves an electronic device package that features a substrate assembly and an electronic device positioned to face it. This package includes a sealing ring with a closed-loop shape surrounding the sealing region of the electronic device. The bonding layer is formed through a reaction involving a low-melting-point material, creating electrical connections between the substrate assembly and the electronic device.

Career Highlights

Throughout his career, Deok Hoon Kim has worked with notable companies such as Optopac, Inc. and Optopac Co., Ltd. His work has significantly impacted the development of advanced materials and electronic packaging solutions.

Collaborations

Kim has collaborated with esteemed colleagues, including John J H Reche and Peter Elenius, contributing to the advancement of technology in his field.

Conclusion

Deok Hoon Kim's innovative work in functional fibers and electronic device packaging demonstrates his commitment to enhancing technology. His patents reflect a deep understanding of materials science and engineering, positioning him as a key figure in the industry.