This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations of Denis Myasishchev
Introduction
Denis Myasishchev is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include "Laser ablation-based surface property modification and contamination removal." These embodiments disclose electronic packages that comprise a mold layer and a die embedded within the mold layer. Additionally, the electronic package features a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. Notably, the second surface includes a first cavity into the solder resist.
Career Highlights
Denis Myasishchev is currently employed at Intel Corporation, where he continues to push the boundaries of technology and innovation. His work focuses on enhancing electronic packaging through advanced methods.
Collaborations
Some of his coworkers include Andrew V Mazur and Purushotham Kaushik Muthur Srinath, who contribute to the collaborative environment at Intel Corporation.
Conclusion
Denis Myasishchev's contributions to electronic packaging through his patents reflect his dedication to innovation in technology. His work at Intel Corporation continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile