Deborah S Kaller

Title: Innovations by Deborah S Kaller

Introduction

Deborah S Kaller is an accomplished inventor based in Auburn, CA (US). She has made significant contributions to the field of integrated circuit packaging, holding 2 patents to her name. Her work focuses on advanced assembly techniques that enhance the performance and reliability of electronic components.

Latest Patents

Kaller's latest patents include methods for implementing micro BGA assembly techniques for small die. The first patent introduces a method of packaging an integrated circuit into an integrated circuit assembly. This method involves mounting polyimide tape to a lead frame, which serves as a substrate for the integrated circuit package. An elastomer is then coupled to the polyimide tape, followed by the attachment of an integrated circuit die to the elastomer. Lead beams are bonded from the bond pads on the die to the lead frame, and solder balls are attached to the lead frame, which may extend beyond the area of the die. The second patent reiterates this innovative approach, emphasizing the efficiency and effectiveness of the micro BGA assembly techniques.

Career Highlights

Deborah Kaller is currently employed at Intel Corporation, where she continues to push the boundaries of technology in her field. Her expertise in micro BGA assembly techniques has positioned her as a key player in the development of advanced electronic packaging solutions.

Collaborations

Throughout her career, Kaller has collaborated with notable colleagues, including Steven R Eskildsen and Richard B Foehringer. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Deborah S Kaller's contributions to the field of integrated circuit packaging are noteworthy and impactful. Her innovative patents and work at Intel Corporation highlight her dedication to advancing technology in the electronics industry.