Company Filing History:
Years Active: 2000-2007
Title: The Innovative Contributions of Deborah L. Thompson
Introduction
Deborah L. Thompson is a prominent inventor based in Tempe, AZ (US). She has made significant contributions to the field of integrated circuit packaging, holding a total of 5 patents. Her work has been instrumental in advancing technology in this area.
Latest Patents
One of her latest patents is for a "Windowed package having embedded frame." This innovative integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound features a frame embedded within it, which has a top surface, a bottom surface, and a top-to-bottom opening. The die is attached to the mold compound, with the embedded frame lying below the periphery of the die. The window is affixed to the mold compound and positioned above the die to allow light to reach it. This design enhances the functionality and efficiency of IC packages.
Career Highlights
Deborah L. Thompson is currently employed at Intel Corporation, where she continues to push the boundaries of technology. Her expertise in integrated circuit packaging has made her a valuable asset to the company.
Collaborations
Throughout her career, Deborah has collaborated with notable colleagues, including Kabul S. Sengupta and Zong-Fu Li. These partnerships have fostered innovation and contributed to the success of her projects.
Conclusion
Deborah L. Thompson's contributions to the field of integrated circuit packaging are noteworthy. Her innovative patents and collaborations reflect her commitment to advancing technology. She continues to inspire future generations of inventors and engineers.