Intel Corporation

Deborah L Thompson

Kabul S Sengupta

Zong-Fu Li

Naoyuki Nagai

Carl E Sklenicka

Nobuyuki Takehashi

Raul A Arellano

Kouichiro Nomoto

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

Windowed package having embedded frame

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

Windowed non-ceramic package having embedded frame

A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.

Mass reflowable windowed package

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Tempe, AZ, United States of America

Deborah L Thompson