This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: DeaWhan Kim: Innovator in Semiconductor Packaging
Introduction
DeaWhan Kim is a notable inventor based in Kyungkido, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and functionality of semiconductor systems.
Latest Patents
One of DeaWhan Kim's key patents is a semiconductor package system with a cavity substrate. This invention involves a unique design that includes a cavity substrate with a cavity, a metal die pad attached to the substrate, and a semiconductor die positioned within the cavity. The system also features solder connectors that facilitate connections on the system board, ensuring seamless integration with the metal die pad.
Career Highlights
DeaWhan Kim is currently employed at Stats Chippac Pte. Ltd., where he continues to develop innovative semiconductor solutions. His work at the company has positioned him as a valuable asset in the field of semiconductor technology. With a patent portfolio that includes 1 patent, he demonstrates a commitment to advancing the industry.
Collaborations
Throughout his career, DeaWhan Kim has collaborated with talented individuals such as SangJo Kim and OhSug Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
DeaWhan Kim's contributions to semiconductor packaging highlight his role as an influential inventor in the technology sector. His innovative designs and collaborative efforts continue to shape the future of semiconductor systems.