Dean L Monthei

Title: Innovations of Dean L Monthei

Introduction

Dean L Monthei is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of microelectronics, holding a total of 2 patents. His work focuses on improving the reliability and performance of integrated circuit modules.

Latest Patents

Monthei's latest patents include an "Apparatus and method for reduced delamination of an integrated circuit module." This invention addresses the issue of delamination in integrated circuit modules by utilizing a laminate substrate that features a die attach pad with a combination of metal oxide and non-oxidized metal regions. Another significant patent is the "Substrateless package," which describes a microelectronic device that includes a die with a conductive pillar and a molding material that encases both the die and the pillar. These innovations reflect Monthei's commitment to advancing technology in the semiconductor industry.

Career Highlights

Monthei is currently employed at Triquint Semiconductor Corporation, where he continues to develop cutting-edge technologies. His expertise in microelectronics has positioned him as a valuable asset to his team and the industry at large.

Collaborations

Monthei has collaborated with talented individuals such as Frank J Juskey and Antonio Espinoza. Their combined efforts contribute to the innovative environment at Triquint Semiconductor Corporation.

Conclusion

Dean L Monthei's contributions to the field of microelectronics through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in integrated circuit technology.