The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Jan. 20, 2007
Dean L. Monthei, Beaverton, OR (US);
Antonio Espinoza, Lake Oswego, OR (US);
Waldemar J. Holgado, Hillsboro, OR (US);
Dean L. Monthei, Beaverton, OR (US);
Antonio Espinoza, Lake Oswego, OR (US);
Waldemar J. Holgado, Hillsboro, OR (US);
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Abstract
An apparatus and method for reducing delamination of an integrated circuit module is disclosed. The integrated circuit module includes a laminate substrate. The integrated circuit module further includes an integrated circuit die operably coupled with the laminate substrate and a plastic semiconductor package overmolded with the laminate substrate. The laminate substrate includes a die attach pad including a plurality of metal oxide regions and non-oxidized metal regions disposed on the die attach pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile