David William Folmar

This inventor holds 3 USPTO granted patents. Top assignee: Corning Incorporated. Active years: 2006-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David William Folmar. Retrieved from https://idiyas.com/inventor/david-william-folmar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 66.7

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 15(Granted Patents)

Company Filing History:

3 out of 7,479

Corning Incorporated

patents

Years Active: 2006-2013

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8591287 - Methods of fabricating a honeycomb extrusion die from a die body (2013-11-26),

2. 8244497 - Method of solving a process function for manufacturing an extrusion die (2012-08-14),

3. 6989119 - Honeycomb extrusion dies (2006-01-24),

Title: The Inventor David William Folmar: Pioneering Innovations in Campbell, NY

Introduction: David William Folmar is a distinguished inventor based in Campbell, NY, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: David William Folmar holds several patents in diverse areas, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, David William Folmar has consistently pushed the boundaries of innovation, earning recognition for his exceptional creativity and problem-solving skills.

Collaborations: David William Folmar has collaborated with leading experts in the industry, fostering a culture of innovation and knowledge-sharing to drive progress and development in his field.

Conclusion: David William Folmar's passion for innovation and his relentless pursuit of excellence continue to inspire aspiring inventors and shape the future of technology and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]