Company Filing History:
Years Active: 2004-2007
Title: The Innovative Contributions of David W. Boldridge
Introduction
David W. Boldridge is a notable inventor based in Oswego, IL (US), recognized for his significant contributions to the field of chemical-mechanical polishing. With a total of 3 patents to his name, Boldridge has made strides in developing advanced polishing systems that enhance substrate processing.
Latest Patents
One of his latest patents is titled "Anionic abrasive particles treated with positively charged polyelectrolytes for CMP." This invention provides chemical-mechanical polishing systems and methods for polishing a substrate using a combination of abrasive particles, a liquid carrier, and a positively charged polyelectrolyte with a molecular weight of about 15,000 or more. The abrasive particles are electrostatically associated with the positively charged polyelectrolyte, which improves the efficiency of the polishing process. Another significant patent is the "Method of polishing or planarizing a substrate." This method involves abrading a substrate surface made of metal, metal oxide, or metal composite with a composition that includes a metal oxide abrasive and a liquid carrier, ensuring optimal pH levels and hydroxyl group density for effective polishing.
Career Highlights
David W. Boldridge is currently associated with Cabot Microelectronics Corporation, where he continues to innovate and develop new technologies in the field of polishing systems. His work has been instrumental in advancing the capabilities of chemical-mechanical polishing, which is crucial for various applications in semiconductor manufacturing and other industries.
Collaborations
Throughout his career, Boldridge has collaborated with esteemed colleagues such as Isaac K. Cherian and Phillip W. Carter. These collaborations have fostered a productive environment for innovation and have contributed to the successful development of new technologies.
Conclusion
David W. Boldridge's contributions to the field of chemical-mechanical polishing through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in substrate processing technologies.
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