Company Filing History:
Years Active: 2018-2022
Title: Innovation Spotlight: Inventor David Unruh of Chandler, AZ
Introduction: Meet the brilliant inventor, David Unruh, hailing from Chandler, Arizona, with a passion for pioneering technological advancements in the field of high-density package substrates and surface finishes for high-density interconnect architectures.
Latest Patents: David Unruh's latest patents include groundbreaking inventions such as the 'High density package substrate formed with dielectric bi-layer', which revolutionizes the fabrication process of IC package substrates, and the 'Surface finishes for high density interconnect architectures', introducing an innovative electroless nickel, electroless palladium, electroless tin stack method for solder bump formation.
Career Highlights: Currently working at Intel Corporation, a leading semiconductor company, David Unruh has successfully obtained four patents throughout his esteemed career, showcasing his expertise in advancing semiconductor technologies and integrated circuit packaging solutions.
Collaborations: Collaborating with talented coworkers like Srinivas V Pietambaram and Rahul N Manepalli, David Unruh has contributed to the development of cutting-edge innovations that have the potential to shape the future of semiconductor industry.
Conclusion: David Unruh's dedication to innovation and inventive spirit have led to significant contributions in the field of semiconductor technologies. With his groundbreaking patents and collaborative work at Intel Corporation, he continues to push the boundaries of technological advancements, positioning himself as a key figure in the realm of high-density package substrates and surface finishes for high-density interconnect architectures.