This inventor holds 2 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2014-2016.
Company Filing History:
Years Active: 2014-2016
Title: David Swindler: Innovator in Semiconductor Technology
Introduction
David Swindler is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to semiconductor constructions and methods.
Latest Patents
His latest patents focus on semiconductor constructions and methods of forming these constructions. Some embodiments include a semiconductor construction featuring a pair of lines extending primarily along a first direction, with a pair of contacts positioned between the lines. The contacts are spaced from one another by a lithographic dimension and are also spaced from the lines by sub-lithographic dimensions. Additionally, the methods involve forming features over a base, where each feature has a first type sidewall and a second type sidewall. The features are separated by gaps, with some being first type gaps and others second type gaps. Masking material is selectively formed to fill the first type gaps relative to the second type gaps, and excess masking material is removed to create a patterned mask. A pattern is then transferred from the patterned mask into the base.
Career Highlights
David Swindler is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to further develop his expertise and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
He collaborates with talented coworkers, including Justin B Dorhout and Ranjan Khurana, who share his passion for innovation in the semiconductor field.
Conclusion
David Swindler's contributions to semiconductor technology through his patents and work at Micron Technology Incorporated highlight his role as an influential inventor in the industry. His innovative methods and constructions continue to shape the future of semiconductor applications.
