Location History:
- Newark, DE (US) (2002 - 2005)
- Wilmington, DE (US) (2022)
Company Filing History:
5 out of 93 
2 out of 309 
Years Active: 2002-2022
Title: Innovations by David Shidner
Introduction
David Shidner is a notable inventor based in Newark, DE (US). He has made significant contributions to the field of chemical mechanical polishing, holding a total of 7 patents. His work has advanced the technology used in semiconductor manufacturing, particularly in the development of polishing pads and methods.
Latest Patents
One of his latest patents is titled "Methods of making chemical mechanical polishing layers having improved uniformity." This invention provides methods for manufacturing a chemical mechanical polishing (CMP) layer for polishing substrates, such as semiconductor wafers. The process involves providing a composition of liquid-filled microelements with a polymeric shell, classifying the composition to remove fines and coarse particles, and forming the CMP polishing layer through innovative techniques.
Another significant patent is "Polishing pads for chemical mechanical planarization." This patent describes an improved pad and process for polishing metal damascene structures on semiconductor wafers. The process includes pressing the wafer against a polymer sheet combined with an aqueous-based liquid, allowing for effective planar removal of the wafer's surface. The polishing pad is characterized by low elastic recovery, high energy dissipation, and stable morphology, which leads to numerous benefits such as reduced pad conditioning and longer pad life.
Career Highlights
David Shidner has worked with prominent companies in the industry, including Rodel Holdings, Inc. and Rohm and Haas Electronic Materials CMP Holdings, Inc. His experience in these organizations has contributed to his expertise in the field of semiconductor manufacturing.
Collaborations
Throughout his career, David has collaborated with notable professionals, including Arun Vishwanathan and David B. James. These collaborations have further enriched his work and innovations in the industry.
Conclusion
David Shidner's contributions to the field of chemical mechanical polishing have significantly impacted semiconductor manufacturing. His innovative patents and career achievements highlight his role as a leading inventor in this specialized area.